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T. Haas, C. Zeilmann, A. Backes, A. Bittner, U. Schmid:
"Design and Evaluation of an Active Cooling Concept For Functional Ceramic Circuits";
Talk: 21st Micromechanics and Micro Systems Europe Workshop, Enschede, NL; 09-26-2010 - 09-28-2010; in: "Abstracts", (2010), 80 - 83.

In this study, an innovative cooling concept is
proposed for LTCC (low temperature co-fired ceramics)-
based printed circuit boards. Micromachined channels
are integrated into the glass-ceramic body which are
streamed with water as cooling medium to enhance the
heat transfer from surface mounted components, such as
MMICs or laser diodes compared to conventional
thermal vias made of silver. Coupled thermo-fluidic finite
element analyses are performed to optimize important
parameters such as the channel geometry and the flow
condition in the channel. Next, test structures are
fabricated simulating the dissipated power losses of active
devices by a thick film resistor which was heated up to a
maximum temperature of 92°C with an electrical power
of 0.3 W. Under these conditions, the temperature can be
decreased to about 47°C when forcing water with a
pressure of 0.3 MPa through the micro channel (width:
240 μm, height: 130 μm). In general, the results with
respect to the reduction in temperature as a function of
flow velocities are in good agreement with those gained
from numerical calculations.

LTCC technology, micromachined channels, active cooling, finite element analyses, turbulent flow.