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Talks and Poster Presentations (with Proceedings-Entry):

G. Langer, V. Satzinger, V. Schmidt, G. Schmid, W. Leeb:
"PCB with fully integrated optical interconnects";
Talk: SPIE Photonics West 2011, San Francisco, California, USA; 01-11-2010 - 01-13-2010; in: "Proceedings of SPIE Photonics West 2011", Proceedings of SPIE, (2011), ISSN: 0277-786x; 15 pages.



English abstract:
The increasing demand for miniaturization and design flexibility of polymer optical waveguides integrated into electrical
printed circuit boards (PCB) calls for new coupling and integration concepts.
We report on a method that allows the coupling of optical waveguides to electro-optical components as well as the
integration of an entire optical link into the PCB. The electro-optical devices such as lasers and photodiodes are
assembled on the PCB and then embedded in an optically transparent material. A focused femtosecond laser beam
stimulates a polymerization reaction based on a two-photon absorption effect in the optical material and locally increases
the refractive index of the material. In this way waveguide cores can be realized and the embedded components can be
connected optically. This approach does not only allow a precise alignment of the waveguide end faces to the
components but also offers a truly 3-dimensional routing capability of the waveguides.
Using this technology we were able to realize butt-coupling and mirror-coupling interface solutions in several
demonstrators. We were also manufacturing demonstrator boards with fully integrated driver and preamplifier chips,
which show very low power consumption of down to 10 mW for about 2.5 Gbit/s. Furthermore, demonstrators with
interconnects at two different optical layers were realized.

Keywords:
Optical interconnects, printed circuit board, two-photon absorption, coupling concept, polymer waveguide


"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1117/12.873744


Created from the Publication Database of the Vienna University of Technology.