Publications in Scientific Journals:
H. Ceric, S. Selberherr:
"Electromigration in Submicron Interconnect Features of Integrated Circuits";
Materials Science and Engineering R-Reports,
71
(2011),
5-6;
53
- 86.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1016/j.mser.2010.09.001
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2010/Ceric_Selberherr.PDF
Created from the Publication Database of the Vienna University of Technology.