Talks and Poster Presentations (with Proceedings-Entry):
R. Orio, H. Ceric, S. Selberherr:
"Modeling Electromigration Lifetimes of Copper Interconnects";
Talk: Intl. Symposium on Microelectronics Technology and Devices (SBMicro),
Joao Pessoa, Brazil;
2011-08-30
- 2011-09-02; in: "ECS Transactions",
(2011),
ISBN: 978-1-56677-900-5;
163
- 169.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1149/1.3615190
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2011/BC2011_Orio_1.pdf
Created from the Publication Database of the Vienna University of Technology.