Publications in Scientific Journals:
R. Orio, H. Ceric, S. Selberherr:
"A Compact Model for Early Electromigration Failures of Copper Dual-Damascene Interconnects";
Microelectronics Reliability,
51
(2011),
1573
- 1577.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1016/j.microrel.2011.07.049
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2011/JB2011_Orio_1.pdf
Created from the Publication Database of the Vienna University of Technology.