[Back]


Talks and Poster Presentations (with Proceedings-Entry):

R. Obermaisser, O. Höftberger:
"Fault Containment in a Reconfigurable Multi‐Processor System‐on‐a‐Chip";
Talk: 21st IEEE International Symposium on Industrial Electronics (ISIE 2011), Gdansk, Poland; 2011-06-27 - 2011-06-30; in: "21st IEEE International Symposium on Industrial Electronics (ISIE 2011", IEEE, (2011), ISBN: 978-1-4244-9312-8; 1561 - 1568.



English abstract:
Fault containment between components is a significant property in embedded real-time systems in order to improve robustness, attain clear integration responsibilities and enable modular certification. This paper presents fault containment mechanisms, which are based on the time-triggered Network-on-a-Chip (NoC) of a reconfigurable MPSoC. Each component accesses this NoC via a communication interface that acts as a guardian of the component behavior in the time and value domain. The knowledge about the permitted behavior of a component is written into the communication interfaces by a trusted resource manager. We perform an evaluation of these fault containment capabilities using fault injection experiments. The experiments provide evidence that a faulty component cannot affect the timing or integrity of messages exchanged by other components.

Created from the Publication Database of the Vienna University of Technology.