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Publications in Scientific Journals:

M. J. Cordill, A. Taylor, J. Schalko, G. Dehm:
"Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide";
Journal of Materials Research, 102 (2011), 6; 729 - 734.



English abstract:
The ability to measure the adhesion energy of metal thin films on polymer
substrates is important for the design of reliable flexible electronic
devices. One technique is to create well-defined areas of delamination
(buckles) as a consequence of lateral compressive stresses induced by
tensile straining of the film-substrate system. The adhesion energy is
calculated from the buckle dimensions. In order to improve the adhesion
between the metal film and polymer substrate, thin adhesion layers can be
incorporated. However, interdiffusion and reactions can occur between the
adhesion layer and the metal film when subjected to elevated temperatures.
This is detrimental for the interfacial adhesion, as will be discussed for
Cu films on polyimide with a Ti interlayer subjected to annealing at 350 °C.

German abstract:
The ability to measure the adhesion energy of metal thin films on polymer
substrates is important for the design of reliable flexible electronic
devices. One technique is to create well-defined areas of delamination
(buckles) as a consequence of lateral compressive stresses induced by
tensile straining of the film-substrate system. The adhesion energy is
calculated from the buckle dimensions. In order to improve the adhesion
between the metal film and polymer substrate, thin adhesion layers can be
incorporated. However, interdiffusion and reactions can occur between the
adhesion layer and the metal film when subjected to elevated temperatures.
This is detrimental for the interfacial adhesion, as will be discussed for
Cu films on polyimide with a Ti interlayer subjected to annealing at 350 °C.

Created from the Publication Database of the Vienna University of Technology.