Talks and Poster Presentations (with Proceedings-Entry):
P. K. Gentner, A. Adalan, A.L. Scholtz, C. Mecklenbräuker:
"Impact Analysis of Silicon and Bondwires on an On-Chip Antenna";
Talk: European Conference on Antennas and Propagation (EuCAP) 2012,
Prague (invited);
03-26-2012
- 03-30-2012; in: "Antennas and Propagation (EUCAP), 2012 6th European Conference on",
(2012),
ISBN: 978-1-4577-0919-7;
5 pages.
English abstract:
The efficiency of integrated on-chip antennas is
low due to their small aperture and lossy environment. In this
contribution, the influence of the silicon bulk substrate´s thickness
and conductivity is evaluated as well as the influence of bondwires
in close vicinity to an on-chip antenna. The impact on the antenna
impedance and radiation pattern is analysed and discussed.
Measurements of an on-chip antenna manufactured by utilising
the top metal layer of a standard Complementary Metal-Oxide
Semiconductor (CMOS) are compared to simulation results.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/EuCAP.2012.6206043
Created from the Publication Database of the Vienna University of Technology.