Talks and Poster Presentations (with Proceedings-Entry):
R. Orio, H. Ceric, S. Selberherr:
"Analysis of Resistance Change Development due to Voiding in Copper Interconnects ended by a Through Silicon Via";
Talk: International Symposium on Microelectronics Technology and Devices (SBMicro),
Brasilia, Brazil;
2012-08-30
- 2012-09-02; in: "ECS Transactions",
49,
1
(2012),
ISBN: 978-1-56677-990-6;
273
- 280.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1149/04901.0273ecst
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2012/CP2012_Orio_2.pdf
Created from the Publication Database of the Vienna University of Technology.