Publications in Scientific Journals:
R. Orio, H. Ceric, S. Selberherr:
"Electromigration Failure in a Copper Dual-Damascene Structure with a Through Silicon Via";
Microelectronics Reliability,
52
(2012),
1981
- 1986.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1016/j.microrel.2012.07.021
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2012/JB2012_Orio_1.pdf
Created from the Publication Database of the Vienna University of Technology.