Talks and Poster Presentations (with Proceedings-Entry):
R. Orio, S. Selberherr:
"Formation and Movement of Voids in Copper Interconnect Structures";
Talk: International Conference on Solid State and Integrated Circuit Technology (ICSICT),
Xi'an, China (invited);
2012-10-29
- 2012-11-01; in: "Proceedings of the International Conference on Solid-State and Integrated Circuit Technology (ICSICT)",
(2012),
ISBN: 978-1-4673-2475-5;
378
- 381.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/ICSICT.2012.6467675
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2012/CP2012_Orio_4.pdf
Created from the Publication Database of the Vienna University of Technology.