Talks and Poster Presentations (with Proceedings-Entry):
A. P. Singulani, H. Ceric, S. Selberherr:
"Thermo-mechanical Simulations of an Open Tungsten TSV";
Talk: IEEE Electronics Packaging Technology Conference (EPTC),
Singapore;
2012-12-05
- 2012-12-07; in: "Proceedings of the IEEE 14th Electronics Packaging Technology Conference (EPTC)",
(2012),
ISBN: 978-1-4673-4551-4;
110
- 114.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/EPTC.2012.6507061
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2012/CP2012_Singulani_1.pdf
Created from the Publication Database of the Vienna University of Technology.