Talks and Poster Presentations (with Proceedings-Entry):
A. P. Singulani, H. Ceric, L. Filipovic, E. Langer:
"Impact of Bosch Scallops Dimensions on Stress of an Open Through Silicon Via Technology";
Talk: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
Poland;
2013-04-14
- 2013-04-17; in: "Proceedings of the IEEE 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EurSimE)",
(2013),
ISBN: 978-1-4673-6137-8;
6 pages.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/EuroSimE.2013.6529938
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2012/CP2013_Singulani_1.pdf
Created from the Publication Database of the Vienna University of Technology.