Talks and Poster Presentations (with Proceedings-Entry):
H. Ceric, R. Orio, S. Selberherr:
"Analysis of Solder Bump Electromigration Reliability";
Poster: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Suzhou, China;
2013-07-15
- 2013-07-19; in: "Proceedings of the 20th International Symposium on the Physical & Failure Analysis of Integrated Circuits",
(2013),
ISBN: 978-1-4799-0478-5;
713
- 716.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/IPFA.2013.6599258
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2013/CP2013_Ceric_2.pdf
Created from the Publication Database of the Vienna University of Technology.