Talks and Poster Presentations (with Proceedings-Entry):
A. P. Singulani, H. Ceric, E. Langer:
"Stress Evolution on Tungsten Thin-Film of an Open Through Silicon Via Technology";
Poster: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Suzhou, China;
2013-07-15
- 2013-07-19; in: "Proceedings of the 20th International Symposium on the Physical & Failure Analysis of Integrated Circuits",
(2013),
ISBN: 978-1-4799-0478-5;
216
- 220.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/IPFA.2013.6599155
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2013/CP2013_Singulani_2.pdf
Created from the Publication Database of the Vienna University of Technology.