Talks and Poster Presentations (with Proceedings-Entry):
L. Filipovic, R. Orio, S. Selberherr:
"Process and Reliability of SF6/O2 Plasma Etched Copper TSVs";
Talk: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Ghent, Belgium;
2014-04-07
- 2014-04-09; in: "Proceedings of the IEEE 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)",
(2014),
ISBN: 978-1-4799-4791-1;
4 pages.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/EuroSimE.2014.6813768
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2013/CP2014_Filipovic_5.pdf
Created from the Publication Database of the Vienna University of Technology.