Talks and Poster Presentations (with Proceedings-Entry):
W. H. Zisser, H. Ceric, R. Orio, S. Selberherr:
"Electromigration Induced Stress in Open TSVs";
Talk: IEEE International Reliability Workshop (IIRW),
South Lake Tahoe, USA;
10-13-2013
- 10-17-2013; in: "Final Report of the IEEE International Integrated Reliability Workshop (IIRW)",
(2013),
ISBN: 978-1-4799-0350-4;
142
- 145.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/IIRW.2013.6804179
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2013/CP2013_Zisser_2.pdf
Created from the Publication Database of the Vienna University of Technology.