Talks and Poster Presentations (with Proceedings-Entry):
H. Ceric, S. Selberherr:
"Electromigration Induced Failure of Solder Bumps and the Role of IMC";
Poster: IEEE International Interconnect Technology Conference (IITC),
San Jose, USA;
2014-05-20
- 2014-05-23; in: "Proceedings of the International Interconnect Technology Conference (IITC)",
(2014),
ISBN: 978-1-4799-5017-1;
265
- 267.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/IITC.2014.6831891
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2013/CP2014_Ceric_5.pdf
Created from the Publication Database of the Vienna University of Technology.