Talks and Poster Presentations (with Proceedings-Entry):
L. Filipovic, R. Orio, S. Selberherr:
"Effects of Sidewall Scallops on the Performance and Reliability of Filled Copper and Open Tungsten TSVs";
Talk: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Singapore, Singapore;
2014-06-30
- 2014-07-04; in: "Proceedings of the 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits",
(2014),
ISBN: 978-1-4799-3931-2;
321
- 326.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/IPFA.2014.6898137
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2013/CP2014_Filipovic_7.pdf
Created from the Publication Database of the Vienna University of Technology.