Talks and Poster Presentations (with Proceedings-Entry):
L. Filipovic, F. Rudolf, E. Baer, P. Evanschitzky, J. Lorenz, F. Roger, A. P. Singulani, R. Minixhofer, S. Selberherr:
"Three-Dimensional Simulation for the Reliability and Electrical Performance of Through-Silicon Vias";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Yokohama, Japan;
2014-09-09
- 2014-09-11; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2014),
ISBN: 978-1-4799-5285-4;
341
- 344.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD.2014.6931633
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2014/CP2014_Filipovic_1.pdf
Created from the Publication Database of the Vienna University of Technology.