Talks and Poster Presentations (with Proceedings-Entry):
L. Wang, A. Brown, M. Nedjalkov, C. Alexander, B. Cheng, C. Millar, A. Asenov:
"3D Coupled Electro-Thermal FinFET Simulations Including the Fin Shape Dependence of the Thermal Conductivity";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Yokohama, Japan;
2014-09-09
- 2014-09-11; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2014),
ISBN: 978-1-4799-5285-4;
269
- 272.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD.2014.6931615
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2014/CP2014_Nedjalkov_2.pdf
Created from the Publication Database of the Vienna University of Technology.