Publications in Scientific Journals:
L. Filipovic, S. Selberherr:
"The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias";
Microelectronics Reliability,
54
(2014),
9-10;
1953
- 1958.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1016/j.microrel.2014.07.014
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2014/JB2014_Filipovic_3.pdf
Created from the Publication Database of the Vienna University of Technology.