Publications in Scientific Journals:
W. H. Zisser, H. Ceric, J. Weinbub, S. Selberherr:
"Electromigration Reliability of Open TSV Structures";
Microelectronics Reliability,
54
(2014),
9-10;
2133
- 2137.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1016/j.microrel.2014.07.099
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2014/JB2014_Zisser_1.pdf
Created from the Publication Database of the Vienna University of Technology.