Publications in Scientific Journals:
E. Baer, P. Evanschitzky, J. Lorenz, F. Roger, R. Minixhofer, L. Filipovic, R. Orio, S. Selberherr:
"Coupled Simulation to Determine the Impact of Across Wafer Variations in Oxide PECVD on Electrical and Reliability Parameters of Through-Silicon Vias";
Microelectronic Engineering,
137
(2015),
141
- 145.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1016/j.mee.2014.11.014
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2014/JB2015_Selberherr_1.pdf
Created from the Publication Database of the Vienna University of Technology.