Talks and Poster Presentations (with Proceedings-Entry):
M. Rovitto, W. H. Zisser, H. Ceric, T. Grasser:
"Electromigration Modelling of Void Nucleation in Open Cu-TSVs";
Poster: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Budapest, Hungary;
2015-04-19
- 2015-04-22; in: "Proceedings of the International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)",
IEEE Xplore,
(2015),
ISBN: 978-1-4799-9949-1;
5 pages.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/EuroSimE.2015.7103100
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2014/CP2015_Rovitto_1.pdf
Created from the Publication Database of the Vienna University of Technology.