Talks and Poster Presentations (with Proceedings-Entry):
R. Orio, S. Gousseau, S. Moreau, H. Ceric, S. Selberherr, A. Farcy, F. Bay, K. Inal, P. Montmitonnet:
"On the Material Depletion Rate Due to Electromigration in a Copper TSV Structure";
Poster: IEEE International Reliability Workshop (IIRW),
Fallen Leaf Lake, CA, USA;
2014-10-12
- 2014-10-16; in: "Proceedings of the IEEE International Integrated Reliability Workshop (IIRW)",
(2014),
ISBN: 978-1-4799-7274-6;
111
- 114.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/IIRW.2014.7049523
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2014/CP2014_Orio_1.pdf
Created from the Publication Database of the Vienna University of Technology.