Talks and Poster Presentations (with Proceedings-Entry):
H. Ceric, S. Selberherr:
"Compact Model for Solder Bump Electromigration Failure";
Poster: International Interconnect Technology and Materials for Advanced Metallization Conference (IITC/MAM),
Grenoble, France;
2015-05-18
- 2015-05-21; in: "Proceedings of the International Interconnect Technology and Materials for Advanced Metallization Conference (IITC/MAM)",
(2015),
ISBN: 978-1-4673-7355-5;
159
- 161.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/IITC-MAM.2015.7325651
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2014/CP2015_Ceric_3.pdf
Created from the Publication Database of the Vienna University of Technology.