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J. Summhammer, Z. Halavani:
"Cell interconnection without glueing or soldering for crystalline PV-modules";
Vortrag: Photovoltaic Technical Conference - From Advanced Materials And Processes To Innovative Applications 2015, Aix en Provence (eingeladen); 27.05.2015 - 29.05.2015.

Today's crystalline Si modules from 156 x 156 mm2 cells are "high current - low voltage" devices with thick internal cabling to get low-resistance cell interconnections. In order to maximize
the power output of a module, another format is necessary. Already earlier we identified as a very good option rectangular cells (currently 156 x 39 mm) and overlapping them along the long edges,
because the distance from cell to cell is only 1⁄4, reducing ohmic losses, and the overlap allows to cover the busbars, reducing optical losses. In this work we focus on the long term stability of the
cell interconnections, which consist of pure-pressure elements, and whose concept is not unlike that of NICE-modules. No soldering and no glueing is used in these cell interconnections. The contact between the cells is established by inserting two or more contact
strips between them in the overlap region so that the cells get slightly bent around them during lamination and the contact force is "frozen in". We present results on different contact materials used in rapid ageing tests of modules and in various outdoor modules which have been in operation for almost 2 years.

Photovoltaic modules, resistive losses, solder free

http://publik.tuwien.ac.at/files/PubDat_239267.pdf