Talks and Poster Presentations (with Proceedings-Entry):
S. Papaleo, W. H. Zisser, H. Ceric:
"Factors that Influence Delamination at the Bottom of Open TSVs";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Washington DC, USA;
2015-09-09
- 2015-09-11; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2015),
ISBN: 978-1-4673-7858-1;
421
- 424.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD.2015.7292350
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2015/CP2015_Papaleo_1.pdf
Created from the Publication Database of the Vienna University of Technology.