Talks and Poster Presentations (with Proceedings-Entry):
L. Wang, A. Brown, M. Nedjalkov, C. Alexander, B. Cheng, C. Millar, A. Asenov:
"3D Electro-Thermal Simulations of Bulk FinFETs with Statistical Variations";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Washington DC, USA;
2015-09-09
- 2015-09-11; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2015),
ISBN: 978-1-4673-7858-1;
112
- 115.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD.2015.7292271
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2015/CP2015_Nedjalkov_1.pdf
Created from the Publication Database of the Vienna University of Technology.