L. Filipovic, S. Selberherr:
"Stress in Three-Dimensionally Integrated Sensor Systems";
Microelectronics Reliability, 61 (2016), S. 3 - 10.
http://dx.doi.org/10.1016/j.microrel.2015.09.013Elektronische Version der Publikation:
http://www.iue.tuwien.ac.at/pdf/ib_2016/JB2016_Filipovic_1.pdf