Talks and Poster Presentations (with Proceedings-Entry):
M. Rovitto, H. Ceric:
"Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper Through Silicon Vias";
Talk: IEEE Electronic Components and Technology Conference (ECTC),
Las Vegas, NV, USA;
2016-05-31
- 2016-06-03; in: "Proceedings of IEEE Electronic Components and Technology Conference (ECTC)",
(2016),
ISBN: 978-1-5090-1204-6;
550
- 556.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/ECTC.2016.49
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2016/CP2016_Rovitto1.pdf
Created from the Publication Database of the Vienna University of Technology.