Talks and Poster Presentations (with Proceedings-Entry):
L. Filipovic, S. Selberherr:
"Effects of the Deposition Process Variation on the Performance of Open TSVs";
Poster: IEEE Electronic Components and Technology Conference (ECTC),
Las Vegas, NV, USA;
2016-05-31
- 2016-06-03; in: "Proceedings of IEEE Electronic Components and Technology Conference (ECTC)",
(2016),
ISBN: 978-1-5090-1204-6;
2188
- 2195.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/ECTC.2016.177
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2016/CP2016_Filipovic2.pdf
Created from the Publication Database of the Vienna University of Technology.