Talks and Poster Presentations (with Proceedings-Entry):
L. Filipovic, A. P. Singulani, F. Roger, S. Carniello, S. Selberherr:
"Impact of Across-Wafer Variation on the Electrical Performance of TSVs";
Talk: IEEE International Interconnect Technology Conference (IITC),
San Jose, CA, USA;
2016-05-23
- 2016-05-26; in: "Proceedings of the IEEE International Interconnect Technology Conference (IITC)",
(2016),
ISBN: 978-1-5090-0386-0;
130
- 132.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/IITC-AMC.2016.7507707
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2016/CP2016_Filipovic3.pdf
Created from the Publication Database of the Vienna University of Technology.