Talks and Poster Presentations (with Proceedings-Entry):
S. Papaleo, H. Ceric:
"A Finite Element Method Study of Delamination at the Interface of the TSV Interconnects";
Poster: International Reliability Physics Symposium (IRPS),
Pasadena, CA USA;
2016-04-17
- 2016-04-21; in: "Proceedings of the International Reliability Physics Symposium (IRPS)",
(2016),
ISBN: 978-1-4673-9136-8;
PA-2-1
- PA-2-4.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/IRPS.2016.7574626
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2016/CP2016_Papaleo_2.pdf
Created from the Publication Database of the Vienna University of Technology.