[Back]


Publications in Scientific Journals:

H. Svajdlenková, O. Sausa, J. Steindl, T. Koch, C. Gorsche:
"Microstructural PALS study of regulated dimethacrylates: Thiol- versus β-allyl sulfone-based networks";
Journal of Polymer Science Part B: Polymer Physics, 54 (2016), 23; 2476 - 2484.



English abstract:
Radical photocuring of multifunctional (meth)acrylates is lacking control over the irregular chain growth process yielding highly crosslinked, inhomogeneous networks. Chain transfer agents (CTAs, e.g., thiols or β-allyl sulfones) have been widely used to modify this curing process, thus reducing shrinkage stress and increasing the toughness of the formed photopolymers. Resulting photopolymer networks exhibit higher bulk density, lower crosslinking density, and narrow glass transitions. Consequently, a more homogeneous network structure was postulated for those networks. Whereas macroscopic properties of the modified final materials have already been studied, herein the microstructural arrangement of such modified networks has also been evaluated with the help of positron annihilation lifetime spectroscopy (PALS). A more homogenous network structure with a decreased average free-volume void size was confirmed for CTA-based dimethacrylate networks. A sharper distribution of the ortho-positronium (o-Ps) lifetime, mainly for the β-allyl sulfone-based photopolymers, hints toward a more regulated network structure. Moreover, the combination of PALS, DMTA, density and swelling experiments elucidates relations between void formation, crosslinking density and macroscopic characteristics such as shrinkage stress and mechanical properties. 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016


"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1002/polb.24240

Electronic version of the publication:
http://onlinelibrary.wiley.com/doi/10.1002/polb.24240/abstract


Created from the Publication Database of the Vienna University of Technology.