[Zurück]


Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag):

M. Jandak, T. Neuzil, M. Schneider, U. Schmid:
"Investigation on different damping mechanisms on the Q factor of MEMS resonators";
Vortrag: 30th Eurosensors Conference, EUROSENSORS 2016, Budapest, Hungary; 04.09.2016 - 07.09.2016; in: "Proceedings of the Eurosensors XXX", Procedia Engineering / Elsevier, 168 (2016), ISSN: 1877-7058; S. 929 - 932.



Kurzfassung deutsch:
It is the objective of this study to investigate the impact of different damping mechanisms occurring in micromachined clamped-clamped and clamped-free beams and evaluate the Q-factors determined experimentally against the predictions of analytical models. In detail, design parameters of the beams such as the length, width and thickness are varied to separate thermo-elastic, anchor, and surface related damping effects. Based on the analytical models, several sets of these simple structures which systematically vary in one geometrical parameter are manufactured and measured. By comparing the experimental data with analytical expressions, this study points out some limitations of current damping models especially with respect to anchor damping.

Kurzfassung englisch:
It is the objective of this study to investigate the impact of different damping mechanisms occurring in micromachined clamped-clamped and clamped-free beams and evaluate the Q-factors determined experimentally against the predictions of analytical models. In detail, design parameters of the beams such as the length, width and thickness are varied to separate thermo-elastic, anchor, and surface related damping effects. Based on the analytical models, several sets of these simple structures which systematically vary in one geometrical parameter are manufactured and measured. By comparing the experimental data with analytical expressions, this study points out some limitations of current damping models especially with respect to anchor damping.

Schlagworte:
Anchor damping, thermo-elastics damping, cantilever, bridge, in-plane, out-of-plane


"Offizielle" elektronische Version der Publikation (entsprechend ihrem Digital Object Identifier - DOI)
http://dx.doi.org/10.1016/j.proeng.2016.11.308


Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.