M. Rovitto:
"Electromigration Reliability Issue in Interconnects for Three-Dimensional Integration Technologies";
Betreuer/in(nen), Begutachter/in(nen): H. Ceric, K. Weide-Zaage; Institut für Mikroelektronik, 2016; Rigorosum: 13.12.2016.
http://www.iue.tuwien.ac.at/phd/rovitto/