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Zeitschriftenartikel:

J. Summhammer, Z. Halavani:
"Cell interconnection without glueing or soldering for crystalline Si photovoltaic modules";
EPJ Photovoltaics, 7 (2016), S. 75401 - 75415.



Kurzfassung englisch:
In order to maximize the power output of polycrystalline silicon PV-modules, in previous work we have already tested rectangular cells of 39 ◊ 156 mm which are overlapped along the long sides. The low current density at the cell overlap allows interconnections which need neither soldering nor glueing,
but use metallic strips inserted between the cells in the overlap region. The contact is established by the pressure applied to the module during lamination and is retained by the slightly bent cells in the solidified encapsulant. Here we report on the long term stability of different contact materials and contact cross
sections applied in eight modules of the 240 W class monitored for up to 24 months of outdoor operation and in a variety of small 5-cell modules exposed to rapid ageing tests with up to 1000 thermal cycles. Cells with three different electrode designs were tested and the contact materials were Cu, Ag, SnPbAg and Sn. Focussing especially on series resistance, fill factor and peak power, it is found that Ag-coated contact strips perform equally well and have practically the same stability as soldered cell interconnections. Due
to 70-90% savings in copper and simpler manufacturing the cost of PV-modules may thus be reduced further.

Schlagworte:
silicon solar cells, electrical losses, interconnection technology, photovoltaic modules


"Offizielle" elektronische Version der Publikation (entsprechend ihrem Digital Object Identifier - DOI)
http://dx.doi.org/10.1051/epjpv/2016002

Elektronische Version der Publikation:
http://publik.tuwien.ac.at/files/publik_256377.pdf


Erstellt aus der Publikationsdatenbank der Technischen Universitšt Wien.