Publications in Scientific Journals:
E. Suhir, R. Ghaffarian, J. Nicolics:
"Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design";
Journal of Materials Science, Materials in Electronics,
27
(2016),
3;
2430
- 2441.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1007/s10854-015-4042-8
Electronic version of the publication:
http://link.springer.com/article/10.1007/s10854-015-4042-8
Created from the Publication Database of the Vienna University of Technology.