Publications in Scientific Journals:
E. Suhir, R. Ghaffarian, J. Nicolics:
"Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?";
Journal of Materials Science, Materials in Electronics,
27
(2016),
1;
570
- 579.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1007/s10854-015-3790-9
Electronic version of the publication:
http://link.springer.com/article/10.1007/s10854-015-3790-9
Created from the Publication Database of the Vienna University of Technology.