Talks and Poster Presentations (with Proceedings-Entry):
L. Filipovic, R.L. de Orio, W. H. Zisser, S. Selberherr:
"Modeling Electromigration in Nanoscaled Copper Interconnects";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Kamakura, Japan;
2017-09-07
- 2017-09-09; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2017),
ISBN: 978-4-86348-612-6;
161
- 164.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.23919/SISPAD.2017.8085289
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2017/CP2017_Filipovic_01.pdf
Created from the Publication Database of the Vienna University of Technology.