[Zurück]

Z. Lin, J. Kleinert, S. Tatra, R. Gómez Vázquez, R. Bielak, A. Otto:
"3D Numerical Modeling of Short Pulsed Laser Micromachining Applications";
Vortrag: ICALEO 2017, Atlanta, USA; 26.10.2017 - 27.10.2017.

In consumer electronics industry, semiconductor device manufacturing, and many other industries that widely employ laser micromachining technologies, there has been an ever-growing trend towards better processing quality and improved process throughput. However, optimization of process parameters to achieve desired quality and throughput often involves time-consuming trial-and-error experiments. Aiming to help minimizing the time and cost for process development and provide useful physical insights into laser micromachining applications, a 3D multi-physical simulation model, based on a modified volume-of-fluid (VOF) approach, was developed. The model explicitly accounts for the propagation of laser beam at predefined trajectories and its interaction with work targets, laser-induced phase transformations (melting, evaporation and resolidification), as well as coupled heat and fluid/gas flow during the laser processing. In particular, for ultrafast laser processes involving ultrashort pulses, two-temperature-model (TTM) is solved for electron and lattice temperatures in the ultrafast laser-induced non-equilibrium during and shortly after the laser irradiation. Temperature dependent thermalphysical properties including electron-phonon coupling and electron heat capacity are considered in the simulations. In this presentation, 3D numerical simulations of typical nanosecond and ultrafast laser micromachining process, such as via drilling and cutting, of different materials including metals, silicon as well as multi-layer print-circuit-board (PCB), will be shown and compared with experimental data. Good agreement between simulations and experimental results is observed.

In consumer electronics industry, semiconductor device manufacturing, and many other industries that widely employ laser micromachining technologies, there has been an ever-growing trend towards better processing quality and improved process throughput. However, optimization of process parameters to achieve desired quality and throughput often involves time-consuming trial-and-error experiments. Aiming to help minimizing the time and cost for process development and provide useful physical insights into laser micromachining applications, a 3D multi-physical simulation model, based on a modified volume-of-fluid (VOF) approach, was developed. The model explicitly accounts for the propagation of laser beam at predefined trajectories and its interaction with work targets, laser-induced phase transformations (melting, evaporation and resolidification), as well as coupled heat and fluid/gas flow during the laser processing. In particular, for ultrafast laser processes involving ultrashort pulses, two-temperature-model (TTM) is solved for electron and lattice temperatures in the ultrafast laser-induced non-equilibrium during and shortly after the laser irradiation. Temperature dependent thermalphysical properties including electron-phonon coupling and electron heat capacity are considered in the simulations. In this presentation, 3D numerical simulations of typical nanosecond and ultrafast laser micromachining process, such as via drilling and cutting, of different materials including metals, silicon as well as multi-layer print-circuit-board (PCB), will be shown and compared with experimental data. Good agreement between simulations and experimental results is observed.