[Back]

N. Zecevic, M. Hofbauer, B. Goll, H. Zimmermann, S. Tondini, A. Chalyan, G. Fontana, L. Pavesi, F. Testa, S. Stracca, A. Bianchi, C. Manganelli, P. Velha, P. Pintus, C. Oton, C. Kopp, L. Adelmini, O. Lemonnier, G. Pares, G. Chiaretti, A. Serrano, J. Ayucar, G. Preve, M. Kim, J. Lee:
"A 3D Photonic-Electronic Integrated Transponder Aggregator With 48 × 16 Heater Control Cells";
IEEE Photonics Technology Letters, Vol. 30 (2018), No. 8; 681 - 684.

An electronic integrated circuit (EIC) and a silicon photonic integrated circuit (PIC) are 3D-integrated. The EIC using the complementary metal-oxide-semiconductor (CMOS)part of STMicroelectronics´ BCD8sp 0.16 μm technology controls all 768 switches in the PIC individually and monitors them with 84 transimpedance amplifiers. A scalable analog-digital approach with a cell size of 100 × 100 μm² for thermal control of optical ring resonator switch matrices is introduced. An electrical power consumption of 220 mW for all electronic control circuits of the optical switch matrix is resulting in 5.5% of the power needed
by a constant-voltage control approach.

Optical switches, micro-ring resonator, thermal tuning, 3D integration, electronic-photonic integration, low power consumption, heater control.

http://dx.doi.org/10.1109/LPT.2018.2811464