Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag):
A. Otto, R. Gómez Vázquez, U. Hartel, S. Mosbah:
"Numerical analysis of process dynamics in laser welding of Al and Cu";
Vortrag: 10th CIRP Conference on Photonic Technologies [LANE 2018],
Fürth, Germany;
03.09.2018
- 06.09.2018; in: "Procedia CIRP",
Procedia CIRP /,
74
(2018),
ISSN: 2212-8271;
S. 691
- 695.
Kurzfassung deutsch:
The process windows for welding Al and Cu are quite limited due to process instabilities like spiking or humping that lead to severe welding failures. Within this paper the fluiddynamical reasons for these instabilities will be analysed by means of multiphysical numerical simulations of the laser beam welding process. After a short introduction into the process model, the simulation results will be verified on basis of experimental results. Then we will focus on the analysis of the different process dynamics during welding for both Al and Cu. The reasons for the humping and spiking instabilities will be revealed. Finally an outlook on current developments, e.g. concerning the grain growth during solidification, will be given.
Kurzfassung englisch:
The process windows for welding Al and Cu are quite limited due to process instabilities like spiking or humping that lead to severe welding failures. Within this paper the fluiddynamical reasons for these instabilities will be analysed by means of multiphysical numerical simulations of the laser beam welding process. After a short introduction into the process model, the simulation results will be verified on basis of experimental results. Then we will focus on the analysis of the different process dynamics during welding for both Al and Cu. The reasons for the humping and spiking instabilities will be revealed. Finally an outlook on current developments, e.g. concerning the grain growth during solidification, will be given.
Schlagworte:
laser welding; multiphysical simulation;welding defects;humping;spiking
"Offizielle" elektronische Version der Publikation (entsprechend ihrem Digital Object Identifier - DOI)
http://dx.doi.org/10.1016/j.procir.2018.08.040
Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.