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Talks and Poster Presentations (with Proceedings-Entry):

A. Otto, R. Gómez Vázquez, U. Hartel, S. Mosbah:
"Numerical analysis of process dynamics in laser welding of Al and Cu";
Talk: 10th CIRP Conference on Photonic Technologies [LANE 2018], Fürth, Germany; 2018-09-03 - 2018-09-06; in: "Procedia CIRP", Procedia CIRP /, 74 (2018), ISSN: 2212-8271; 691 - 695.



English abstract:
The process windows for welding Al and Cu are quite limited due to process instabilities like spiking or humping that lead to severe welding failures. Within this paper the fluiddynamical reasons for these instabilities will be analysed by means of multiphysical numerical simulations of the laser beam welding process. After a short introduction into the process model, the simulation results will be verified on basis of experimental results. Then we will focus on the analysis of the different process dynamics during welding for both Al and Cu. The reasons for the humping and spiking instabilities will be revealed. Finally an outlook on current developments, e.g. concerning the grain growth during solidification, will be given.

German abstract:
The process windows for welding Al and Cu are quite limited due to process instabilities like spiking or humping that lead to severe welding failures. Within this paper the fluiddynamical reasons for these instabilities will be analysed by means of multiphysical numerical simulations of the laser beam welding process. After a short introduction into the process model, the simulation results will be verified on basis of experimental results. Then we will focus on the analysis of the different process dynamics during welding for both Al and Cu. The reasons for the humping and spiking instabilities will be revealed. Finally an outlook on current developments, e.g. concerning the grain growth during solidification, will be given.

Keywords:
laser welding; multiphysical simulation;welding defects;humping;spiking


"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1016/j.procir.2018.08.040


Created from the Publication Database of the Vienna University of Technology.