Talks and Poster Presentations (with Proceedings-Entry):
L. Filipovic, R. Orio:
"Modeling the Influence of Grains and Material Interfaces on Electromigration";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Austin, Texas, USA;
2018-09-24
- 2018-09-26; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2018),
ISBN: 978-1-5386-6788-0;
83
- 87.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD.2018.8551746
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2018/CP2018_Filipovic_3.pdf
Created from the Publication Database of the Vienna University of Technology.