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Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag):

P. Steinbauer, A. Rohatschek, O.G. Andriotis, R. Liska, P.J. Thurner, S. Baudis:
"Adhesion motifs for bone glue applications";
Vortrag: Austrian Bone Conference - ABC 2018, Wien; 23.11.2018 - 24.11.2018; in: "Austrian Bone Conference - ABC 2018", Wiener Medizinische Wochenschrift; Springer-Verlag Austria, November 2018, Volume 168, Supplement 2 (2018), ISSN: 0043-5341; S. 454.



Kurzfassung englisch:
Background: The imagination of being able to glue bone fractures with a biocompatible adhesive system is very attractive in orthopaedic surgery (1). Up to now, most adhesives still bear several drawbacks ranging from lack of mechanical strength to toxic side effects and possible allergic response.
Materials and Methods: In order to implement a surgically realizable bone glue, adhesives were designed influenced by dental materials and self etching primers. A major challenge in determining the adhesion properties of a putative bone glue is to distinguish between cohesive and adhesive forces. One approach circumventing this problem is to measure the adhesion via single molecule force spectroscopy (SMFS). This approach allows investigation of adhesion processes at molecular level. A specific amino acid sequence was chosen based on its suggested binding properties to hydroxyapatite in statherin (2).
Results and Discussion: It was proven that phosphonic acid primers play a decisive role in adhering on hydroxyapatite mimicking bone and TiO2 mimicking implants. This is a substantial progress for designing bioadhesive systems.
Conclusion: By the establishment of a procedure to graft an AFM tip with adhesion motifs, it is possible to measure adhesion forces at molecular level. Further research is now required at larger length scales to elucidate the feasibility of adhesives based on these motifs.

Schlagworte:
bone glue applications, biocompatible adhesive system, orthopaedic surgery, distinguish between cohesive and adhesive forces

Erstellt aus der Publikationsdatenbank der Technischen Universitšt Wien.