Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag):
T. Nguyen, L. Lê, H. Truong, K. Nguyen-An, P. Ha:
"Handling Service Level Agreements in IoT = Minding Rules + Log Analytics?";
Vortrag: IEEE 22nd International Enterprise Distributed Object Computing Conference (EDOC 2018),
Stockholm, Sweden;
16.10.2018
- 19.10.2018; in: "Proceedings of the IEEE 22nd International Enterprise Distributed Object Computing Conference (EDOC 2018)",
IEEE,
(2018),
ISBN: 978-1-5386-4140-8;
S. 145
- 153.
Kurzfassung englisch:
With the rise of Internet of Things, end-users expect to obtain data from well-connected smart devices and stations through data services being provisioned in distributed architectures. Such services could be aggregated in a number of smart ways to provide the end-users and third-party applications with sophisticated data (e.g., weather data coupled with soil pollution), resulting in a growing number of service offerings to be requested. Service offerings that have been shortlisted for a certain data request (e.g., rainfall in a particular farming site) need to be ranked according to the end-users' preference. Service level agreements, i.e., the mutual responsibilities between the service provider and its consumers, address this sort of preference. Unfortunately, provisioning quality-aware services under this term still stays on the sidelines. In this paper, we propose a novel service architecture where the service level agreements shall be: (i) accumulated overtime on IoT service transactions; (ii) compiled when aggregating IoT services; (iii) used as a ranking criterion for suggesting IoT service offerings. We demonstrate our new approach in the service provisioning of agricultural datasets taken from a farming site of the Mekong Delta in Vietnam.
Schlagworte:
IoT services, service level agreement, DaaS, recommender systems
"Offizielle" elektronische Version der Publikation (entsprechend ihrem Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/EDOC.2018.00027
Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.