Publications in Scientific Journals:
L. Filipovic:
"A Method for Simulating the Influence of Grain Boundaries and Material Interfaces on Electromigration";
Microelectronics Reliability,
97
(2019),
38
- 52.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1016/j.microrel.2019.04.005
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2019/JB2019_Filipovic_1.pdf
Created from the Publication Database of the Vienna University of Technology.